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PCB ASSEMBLY

PCB ASSEMBLY
Since 2006, Hangzhou singo tech co.,ltd. has been distinguishing itself as a leader in pcb assembly, box building and electronic contract manufacturing experience brought us a range of abilities to manage throughout process of electronics PCB manufacturer, PCB assembly (PCBA), technical analysis, prototype, batch production and logistics. Unique sense of offering outstanding services is our label in winning international marketplace.
We can perform the repair and planned test for your PCB assembly (PCBA), such as BGA rework, test frame burning program and test frame etc. Your various batch production could be processed by our dedicated engineers.
PCB Assembly has state-of-the-art assembly plants that allow us to follow your project through every step of the assembly process. We handle all types of pcb assembly, from basic thru hole PCB assembly to standard surface mount PCB assembly to ultra-fine pitch BGA assembly. Our engineers work with customers from across all fields including consumer electronics, wireless, medial, automotive and instrumentation.
1. PCB assembly OEM service
*Electronic components material purchasing
*Bare PCB fabrication 
*PCB Assembly Service. (SMT, BGA, DIP)
*FULL Test: X-RAY,AOI, In-Circuit Test (ICT), Functioal Test (FCT),
*Cable, and Wire-harness assembly
*Conformal coating service
*Prototyping and mass production...
2. PCBA ODM service
*PCB layout, PCBA design according to your idea
*PCBA copy/clone
* Analog Circuit Design/ lRF Design /Digital Circuit Design /Embedded Software Design
*Firmware and Microcode Programming Windows Application (GUI) Programming/  Windows Device Driver (WDM) Programming
*lSystem Hardware Design/Embedded User Interface Design ……
3. Added value service
*Plastic injection molding
*Metal stamping
*Rubber&Silicone parts
*Packages customized...
4. Professional sales engineers and technicians,Effective communication
5.After-Sale service
PCB Assembly Service
*Prototype PCB Assembly
*SMT Assembly (Surface Mount Technology)
*BGA Assembly ( Ball Grid Array)
*DIP Assembly
*Soldering Assembly
*Box Build Assembly
One-stop PCBAPCB+components sourcing+assembly+test+package
Assembly detailsSMT and Thru-hole
Lead TimePrototype: 7-15 work days. Batch order 20~25 work days usually
Testing on productsFlying Probe Test, X-ray Inspection, AOI Test, Functional test
PCB Solder TypeWater Soluble Solder Paste, RoHS lead free
Components detailsPassive Down to 0201 size
BGA and VFBGA
Leadless Chip Carriers/CSP
Double-sided SMT Assembly
Fine Pitch to 0.8mils
BGA Repair and Reball
Part Removal and Replacement
Component packageCut Tape,Tube,Reels,Loose Parts